Online applications are invited for the Interim Engineering Intern at Qualcomm, Hyderabad. Check the details below!

About Qualcomm

Qualcomm is enabling a world where everyone and everything can be intelligently connected. You interact with products and technologies made possible by Qualcomm every day, including 5G-enabled smartphones that double as pro-level cameras and gaming devices, smarter vehicles and cities, and the technology behind the smart, connected factories that manufacture your latest purchase. Our powerful connectivity solutions keep you connected—even in remote areas.

Qualcomm 5G and AI innovations are the power behind the connected intelligent edge. You’ll find our technologies behind and inside the innovations that deliver significant value across multiple industries and to billions of people every day.

Job Description

Qualcomm knows its employees’ ideas change the world. For more than three decades, they’ve been a global leader in mobile technology, continually pushing the boundaries of what’s possible. Working with customers across industries — from automotive to health care, from smart cities to robotics— we continue to accelerate innovation and unlock new possibilities in a time where everything is connected. By joining the Qualcomm family, you too can bring the future forward faster.

SOC & Hard Macro Physical Design

  • SOC Validation & Debug
  • RF & Analog Layout
  • RF/Analog/Mixed Signal/Power IC Design
  • Low Power Design
  • Board and FPGA Design
  • Digital ASIC Design
  • Design/SOC Verification
  • CAD Solution Engineer
  • Design for Test (DFT)
  • CPU Design

Qualifications

Masters, Bachelors: Electrical Engineering, VLSI, Embedded and VLSI, ECE

Required Skill Sets

Must have educational background in one or more of the following areas:

  • Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
  • Verilog or VHDL, C/C++, Tcl/Perl/shell scripting. RTL design experience and/or strong OO programming knowledge
  • Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
  • Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
  • Excellent analytical and problem-solving skills.
  • Ability to collaborate and work in teams.
  • Good verbal and written communication skills.

Accommodations Support

If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport[at]qualcomm[dot]com.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Stipend

  • ₹ 58,896 – ₹ 60,382/month
  • Note: Stipend information is taken from here.

How to Apply?

Interested candidates can directly apply through this link.

Location

Hyderabad, Telangana.

Click here to view the official notification of the Interim Engineering Intern at Qualcomm, Hyderabad.

Image Source